Achieve quick and secure desoldering with vacuum function, only takes a few seconds removing solder even on a double-sided board.
Microprocessor controlled
Microprocessor Controlled, provides accurate temperature control from 160 to 480°C.
Ceramic heater
Provides fast heat up, fast recovery and high insulation resistance.
High power desoldering tool with vacuum
Designed with a quality heating element, it provides higher performance and longer lifetime than traditional type.
Built-in high power 600mmHg air pump, particularly for lead-free desoldering of multilayer boards.
Efficient operation, quick and easy
Ergonomically friendly structure allows one hand operation, only takes a few seconds per pin, more safe, efficient and comfortable.
Large LCD display
Voltage | 110~120V AC |
Power Consumption | 140W |
Soldering Power | 90W |
Temperature Range | 320°F~896°F (160°C ~ 480°C) |
Control System | Microprocessor |
Vacuum Pump System | Air Pump Motor |
Vacuum Pressure | >600mm Hg |
Heating Element | Ceramic Heater |
Insulation Resistance | 100MΩ |
Ground Resistance | 0.3Ω |
Connecting Cord/Hose Length | 41 in. |
Power Cord Length | 47 in. (3 prong grounded plugg) |
Certificate | cTUVus, RoHS |
Station Size | 6.8 x 5.3 x 7.5 in. |
Weight | 3.5 lbs |
Accessories | Spare tip x 3:(ø1.2(on the gun)ø1.0/ø1.5mm) Cleaning tool x 3 (ø0.7/ø0.9/ø1.2mm) Filter sponge x 4 (ø20.8x1+ø16.8x3 |
Individual packing | Color Box |