Product Attribute | Product Value |
---|---|
Weight | 2 oz |
Material | FR-4 glass-epoxy |
size: 3.9" x 6.3" and 1/16", 1 oz. copper on each side & tinned | |
4 mounting holes in the corners, 2 power rails | |
has ground plane for SOIC, SOT23, 1206, 0805 & other SMIT parts | |
through hole prototyping area for headers, and DIP ICs, spaced 0.10" center | |
every second SMT rectangle pad has an unplated hole |